Ceramic Wafer Chuck

Heat transfer between the chuck and the wafer may be con sidered as the combination of contact point conduction heat.

Ceramic wafer chuck.

Porous ceramic vacuum chuck. The chuck plate plays an integral part in supporting the wafer throughout processing not just to accurately position the wafer during testing. The wafer chuck ensures accurate positioning of the wafer in various process steps. Arc will design a wafer chuck to a customer s unique requirements and quote the finished product.

With our unique know how of ceramic industry and years immersing in semi conductor industry werlchem llc is at the forefront in the development of materials and components for the demanding environments of semiconductor processing such as chuck table wafer carriers cmp grinding and polishing chucks end effectors etc. Our wafer chuck tables electrostatic chucks and heaters are virtually found in many semiconductor equipment in most of. Photomachining offers a variety of porous vacuum chuck designs for use with thin films semiconductor wafers and other flat samples. Shown on the right is a 6 inch diameter free standing porous ceramic chuck plate with pores size 20um 10.

Semixicon is based in the silicon valley serving world wide semiconductor photonics and medical etc industries with precision ceramic machining and assembly solutions with our core technology of wafer handling chuck tables. The shape of the ceramic chuck can be dressed to a conic shape with a very small angle see fig. Arc also manufactures custom chucks from a customer s drawing or solid model. Pared with ceramic the electrostatic force is 1 10 smaller and.

Advanced ceramic vacuum wafer chucks materials developed specifically for wafer handling as a leader in technical ceramics for wafer processing equipment coorstek understands advanced semiconductor manufacturing and constantly develops new materials designs and processes to optimize yields and extend product life. Vacuum wafer chucks are used in the semiconductor industry to accurately position the wafer in the machine. The chuck has a pore size of less than 25 microns 60 microns optional assuring uniform suction and strong holding power for even the smallest parts. With applications for the semiconductor industry ever diversifying so are the substrate and materials used to provide new products.