Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.
Ceramic small outline packages.
Lead count cavity overall layer t hic kness total 0084 0085 0085 0085 lead nt k mat erial code ring connection drawing no o non co ne ct attach.
Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages.
Small outline package straight lead small outline l leaded package 1 27.
Material in laminated ceramic packages.
Also used as a structural material in ceramic.
Up u down d 1st 2nd 3rd total pitch stand off height seal ring.
Material properties process flow.
Standard packages and lids for device evaluation.
Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no.
Ceramic small outline packages offer a readily available surface mount alternative to plastic surface packages.
Ceramic substrates for probe cards.
Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.